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Semiconductor device fabrication
Results: 2185

#	Item
861	HIGH-ASPECT RATIO SUBMICROMETER NEEDLES FOR INTRACELLULAR APPLICATIONS C. G. J. Schabmueller, Y. Hanein, G. Holman, K. F. Böhringer University of Washington, Department of Electrical Engineering, Seattle, Washington 981 Add to Reading List Source URL: www.ee.washington.edu Language: English - Date: 2002-06-13 21:08:00 Technology Chemistry Neurophysiology Deep reactive-ion etching Etching Silicon Microelectromechanical systems Black silicon 100 micrometres Microtechnology Materials science Semiconductor device fabrication
862	TIME-MULTIPLEXED-PLASMA-ETCHING OF HIGH NUMERICAL APERTURE PARABOLOIDAL MICROMIRROR ARRAYS Kerwin Wang, Karl F. Böhringer Electrical Engineering Department, University of Washington Seattle, WA[removed]Phone[removed] Add to Reading List Source URL: www.ee.washington.edu Language: English - Date: 2003-07-09 02:25:14 Technology Micro-Opto-Electro-Mechanical Systems Etching Mirror Deep reactive-ion etching Plasma Microlens Dry etching Reactive-ion etching Microtechnology Materials science Semiconductor device fabrication
863	INTRACELLULAR NEURONAL RECORDING WITH FLEXIBLE MICRO-MACHINED PROBE IMPLANTS Anupama V. Govindarajan1, Tai C. Chen1, Russell C. Wyeth2, A. O. Dennis Willows2 and Karl F. Böhringer1 1 Department of Electrical Engineering Add to Reading List Source URL: www.ee.washington.edu Language: English - Date: 2004-03-15 18:16:55 Neurophysiology Electrophysiology Microtechnology Semiconductor device fabrication Computational neuroscience Single-unit recording Multielectrode array Polyimide Deep reactive-ion etching Neuroscience Biology Science
864	k sloyan COLA2011 #55 revised (double spaced).pdf Add to Reading List Source URL: eprints.soton.ac.uk Language: English - Date: 2012-11-06 07:03:35 Materials science Thin film deposition Diamond simulants Laser machining Pulsed laser deposition Microtechnology Epitaxy Nd:YAG laser Laser Semiconductor device fabrication Optics Technology
865	OCTOBER[removed]VOLUME 59 / NUMBER 10 Figure 1: TiB2-coated endmill with no coating delamination. Figure 2: DLC endmill with coating delamination. Add to Reading List Source URL: www.ctemag.com Language: English - Date: 2007-10-11 08:00:00 Nitrides Superhard materials Semiconductor device fabrication Thin film deposition Endmill Cutting tool Titanium aluminium nitride Titanium nitride Physical vapor deposition Technology Manufacturing Machining
866	PDF Document Add to Reading List Source URL: media.wiley.com Language: English - Date: 2013-08-28 07:15:36 Ceramic materials Semiconductor device fabrication Superhard materials Nanomaterials Chemical vapor deposition Thin film Epitaxy Silicone Ceramic matrix composite Chemistry Matter Thin film deposition
867	Microsoft Word - s7112846.doc Add to Reading List Source URL: www.mdpi.org Language: English - Date: 2007-11-20 03:01:53 Materials science Packaging Accelerometers Failure Semiconductor device fabrication Reliability engineering Reliability Microelectromechanical systems Micro-Opto-Electro-Mechanical Systems Technology Microtechnology Engineering
868	PII: [removed]85010-U Add to Reading List Source URL: doc.utwente.nl Language: English - Date: 2011-08-28 14:43:09 Chemical kinetics Semiconductor device fabrication Ceramic materials Coatings Chemical vapor infiltration Chemical vapor deposition Synthetic membrane Adsorption Catalysis Chemistry Physical chemistry Thin film deposition
869	Provided for non-commercial research and educational use. Not for reproduction, distribution or commercial use. This article was originally published in Comprehensive Microsystems published by Elsevier, and the attached Add to Reading List Source URL: www.ee.washington.edu Language: English - Date: 2008-02-07 20:31:25 Electronics Microtechnology Nanotechnology Electronics manufacturing Electrical engineering Microelectromechanical systems Flip chip Microfabrication Integrated circuit Materials science Technology Semiconductor device fabrication
870	Silicon Micro-Needles with Flexible Interconnections G. Holman1 , Y. Hanein1 , R. C. Wyeth2 , A. O. D. Willows2 , D. D. Denton1 , and K. F. Böhringer1 1 Department of Electrical Engineering, 2Department of Zoology, Univ Add to Reading List Source URL: www.ee.washington.edu Language: English - Date: 2002-03-21 14:35:00 Microtechnology Technology Neurophysiology Deep reactive-ion etching Etching Microelectromechanical systems Multielectrode array Polyimide Wafer Semiconductor device fabrication Materials science Chemistry

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